Imagine joining an industry leader that is shaping the future of mission critical data center infrastructure and manufacturing marketplace development while furthering your career in Mechanical Engineering with AI Cooling Infrastructure experience within the Data Center Space alongside other Electrical and Mechanical Engineering, Technology and Manufacturing professionals. The Mechanical Engineering - AI Cooling Infrastructure role will join our team focused on air-cooling infrastructure solutions for next-generation AI datacenters. This position plays a key role in the product development lifecycle, supporting a Principal Engineer who is currently leading the design efforts. The ideal candidate will bring direct experience in datacenter or HVAC cooling systems and demonstrate a desire to eventually take full ownership of the product line. Why Hyper? ??? Competitive salary and benefits package including: Employer Paid Medical, dental and vision insurance Company-paid life insurance, Company paid short-term and long term disability 401K Plan with company matching Generous PTO policy and paid holidays ??? Collaborative and innovative work environment. ??? Opportunities for professional growth and development. ESSENTIAL FUNCTIONS AND DUTIES: Contribute to the development of rack-level air-cooling solutions engineered for AI workloads, integrating thermal transfer components to support high heat flux removal. Assist in development of test setups and performance monitoring systems for prototype validation. Contribute to product roadmap through thermal modeling, airflow optimization, and iterative design refinement. Use CAD tools (SolidWorks) to create detailed models, drawings, and product documentation. Participate in engineering change processes (redlines, ECOs) to maintain design accuracy and revision control. Manage part libraries, BOMs, and component selection for prototype and production builds. Interface with external partners, contractors, and suppliers to ensure seamless project execution and delivery timelines. REQUIREMENTS: Bachelor's degree in Mechanical Engineering required. Advanced degree or equivalent hands-on experience in datacenter cooling systems preferred. 7+ years of relevant experience in mechanical engineering roles, ideally including datacenter and/or electronics. Deep understanding of air-side thermal systems, including heat exchangers, airflow dynamics, and coil/fan behavior Proficient in SolidWorks for mechanical design and drafting Familiarity with industry standards and design codes such as UL 1062, UL 891, NEC Ability to interpret technical drawings, schematics, and system layouts Hyper, Inc. is an equal opportunity employer and is committed to compliance with all applicable laws prohibiting employment discrimination. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity or expression, pregnancy, age, national origin, disability status, genetic information, protected veteran status, or any other characteristic protected by law. All applications will be used exclusively for selection purposes and handled confidentially by authorized personnel only. Your application may also be considered for other suitable positions within Hyper, Inc.
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